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Compact space-saving tabletop ACF bonding device.
- By specializing in compact circuit boards, it is smaller and lighter compared to conventional devices. - Setup and switching are easy, allowing for support of a wide variety of types and models. - By using the optional adjustable circuit board fixture, easy crimping operations can be immediately performed on circuit boards measuring 90mm x 110mm or smaller.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
Omiya Engineering provides support for product development, such as modularizing devices developed by our customers. We have our own original vacuum lamination equipment and ACF bonding equipment, which can be customized. We are capable of one-stop solutions not only for development but also for mass production processes. Utilizing the unique technology and expertise of a semiconductor equipment manufacturer, we achieve high quality and productivity. Please feel free to contact us when needed. 【Features】 ■ We have our own original ACF bonding equipment and can accommodate customization. ■ We manufacture the jigs necessary for prototype development. ■ We offer detailed development and proposals tailored to customer requests. ■ We can provide one-stop solutions not only for development but also for mass production processes. *For more details, please refer to the PDF materials or feel free to contact us.
Customizable to fit your usage needs! Compact, space-saving tabletop ACF bonding device.
The "ACF Bonding Device" is a tabletop device used for thermal bonding of anisotropic conductive films (ACF) for connecting FPC/PCBs in automotive, industrial, and consumer equipment. It specializes in the small-lot production of various small components, making it suitable for development, research, and repair applications. By focusing on small PCBs, it is smaller and lighter compared to general devices. Additionally, by using an optional multi-fixing jig, experimental bonding operations can be immediately executed for PCBs measuring 144mm x 77mm or smaller. 【Features】 - Smaller and lighter compared to general devices by specializing in small PCBs - Capable of accommodating ACF bonding lengths from 14mm to 64mm - The temporary bonding device is equipped with ACF half-cut and automatic feeding mechanisms - Customization options are available to match the workpieces used - Easy setup and switching, making it suitable for small-lot production, development, research, and repair applications *For more details, please refer to the PDF document or feel free to contact us.
